Copper Foil 0.1mm - Technical Grade

Minimum Assay: 99.58%
Molecular Formula: Cu
Molecular Formula: 63.55g/mol
Form: Reddish foil
Boiling Point: 2,567 °C 
Melting Point: 1,083.4 °C
Resistivity: 1.673 μΩ-cm, 20 °C 
Thickness: 0.1mm

Cas Number: 7440-50-8

Einecs Number: 231-159-6

HS Code / Commodity Code: 7410110090

Hazard Phrases: H0001